Journal
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING
Volume 93, Issue 2, Pages 74-81Publisher
TAYLOR & FRANCIS LTD
DOI: 10.1179/0020296714Z.000000000220
Keywords
Anodic dissolution; Chloride; Copper; Electrodeposition; Sulphate
Categories
Funding
- School of Engineering Sciences
- Research Institute for Industry (RIfI) at the university
Ask authors/readers for more resources
The electrochemistry of copper deposition and dissolution in chloride-sulphate electrolytes has been investigated using cyclic voltammetry. A wide range of chloride ion concentration (0.02 to 2.0 mol dm(-3) NaCl) in 0.05 mol dm(-3) CuSO4 and 0.5 mol dm(-3) Na2SO4 was used to examine the electrodeposition of copper onto platinum from chloride containing solution at 295 K. Cyclic voltammetry indicated that the stable dichlorocuprous anion was involved in the deposition and dissolution of copper at a platinum disc electrode. The transition from a single, two-electron transfer in a sulphate solution to two, single electron transfers in a chloride-sulphate solution was observed and the effect of chloride ion concentration on the deposition and the stripping charge density were investigated. Cu(II)/Cu(I) was found to be a quasi-reversible couple; the degree of reversibility increased at higher chloride ion concentrations. The formal potential for the reaction Cu(II)-> Cu(I) steadily increased while its exchange current and Tafel slope gradually decreased at higher concentrations of chloride ion. The participation of an adsorbed cuprous chloride filmin the oxidation and reduction reactions is discussed. These findings indicate that the presence of high chloride ion levels in a dilute copper solution inhibits both the deposition and the dissolution of copper.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available