Relating residual stress to thin film growth processes via a kinetic model and real-time experiments

Published 2015 View Full Article

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Title
Relating residual stress to thin film growth processes via a kinetic model and real-time experiments
Authors
Keywords
Stress, Residual stress, Thin films, Wafer curvature, Polycrystalline, Deposition
Journal
THIN SOLID FILMS
Volume 596, Issue -, Pages 2-7
Publisher
Elsevier BV
Online
2015-07-23
DOI
10.1016/j.tsf.2015.06.061

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