Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips

Published 2015 View Full Article

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Title
Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips
Authors
Keywords
-
Journal
SOLID-STATE ELECTRONICS
Volume 113, Issue -, Pages 101-108
Publisher
Elsevier BV
Online
2015-06-08
DOI
10.1016/j.sse.2015.05.023

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