Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effects

Published 2015 View Full Article

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Title
Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effects
Authors
Keywords
-
Journal
SOLDERING & SURFACE MOUNT TECHNOLOGY
Volume 27, Issue 1, Pages 1-6
Publisher
Emerald
Online
2015-01-23
DOI
10.1108/ssmt-03-2014-0008

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