Journal
NANOTECHNOLOGY
Volume 22, Issue 24, Pages -Publisher
IOP PUBLISHING LTD
DOI: 10.1088/0957-4484/22/24/245608
Keywords
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Funding
- Research Institute of Advanced Materials, Seoul National University
- Ministry of Commerce, Industry and Energy (MOCIE), Republic of Korea
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Copper nanoparticles were prepared by the plasma treatment of Cu thin films without extra heating. The Cu nanoparticles were formed through a solid-state dewetting process at temperatures of less than 450 K. The particle sizes, from 10 to 80 nm, were controlled by changing the thickness of the Cu film; the particle size increased linearly with the film thickness. The Cu nanoparticles produced by plasma treatment showed an excellent size uniformity compared to those prepared by heat treatment. In the early stage of the dewetting of the Cu film, uniformly distributed holes nucleated, and the holes grew and coalesced until the Cu nanoparticles were formed. The low operating temperatures used contributed to the production of uniform Cu nanoparticles.
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