Hierarchical Three-Dimensional Layer-by-Layer Assembly of Carbon Nanotube Wafers for Integrated Nanoelectronic Devices

Title
Hierarchical Three-Dimensional Layer-by-Layer Assembly of Carbon Nanotube Wafers for Integrated Nanoelectronic Devices
Authors
Keywords
-
Journal
NANO LETTERS
Volume 12, Issue 9, Pages 4540-4545
Publisher
American Chemical Society (ACS)
Online
2012-08-14
DOI
10.1021/nl3016472

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