Investigation of moisture diffusion in cross-linked epoxy moulding compound by molecular dynamics simulation

Investigation of hygroscopic properties in electronic packages using molecular dynamics simulation

(2011) Seung-Hwan Chang et al.   POLYMER

A molecular modeling study on small molecule gas transportation in poly (chloro-p-xylylene)

(2010) Chunhai Lu et al.   COMPUTATIONAL MATERIALS SCIENCE

Molecular simulation of structure, thermodynamic and transport properties of polyacrylonitrile, polystyrene and their alternating copolymers in high temperatures

(2010) Stelios Karanikas et al.   EUROPEAN POLYMER JOURNAL

Molecular dynamics approach to structure–property correlation in epoxy resins for thermo-mechanical lifetime modeling

(2010) B. Wunderle et al.   MICROELECTRONICS RELIABILITY

Precursor Film in Dynamic Wetting, Electrowetting, and Electro-Elasto-Capillarity

(2010) Quanzi Yuan et al.   PHYSICAL REVIEW LETTERS

Distribution and Diffusion of Water in Model Epoxy Molding Compound: Molecular Dynamics Simulation Approach

(2009) Seung Geol Lee et al.   IEEE TRANSACTIONS ON ADVANCED PACKAGING

Influence of Cross-Linking Density on the Glass Transition and Structure of Chemically Cross-Linked PVA: A Molecular Dynamics Study

(2009) Javier Sacristan Bermejo et al.   MACROMOLECULAR THEORY AND SIMULATIONS

A Molecular Dynamics Study of Epoxy-Based Networks: Cross-Linking Procedure and Prediction of Molecular and Material Properties

(2008) Vikas Varshney et al.   MACROMOLECULES