Journal
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
Volume 16, Issue 4, Pages 633-639Publisher
SPRINGER HEIDELBERG
DOI: 10.1007/s00542-009-0984-1
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Funding
- NSFC [10702037, 50876057]
- Shanghai Pujiang Program [08PJ14054]
- Innovation Program of Shanghai Municipal Education Commission [09YZ01]
- 863 program [2008AA04Z301]
- Swedish National Science Foundation [621-2007-4660]
- Swedish Foundation for Strategic Research [PV08.08]
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In the present paper, a novel and efficient model was developed for predicting the effective thermal conductivity of the composite materials at different filler percentages. By introducing the relative radius as a parameter, the effective thermal conductivity can be predicted precisely when the thermal properties of filler and matrix are prescribed. The model employed the resistor network strategy to achieve a highly efficient prediction during the overall conductivity calculation. To verify this model, a wide range of two-phase composites, including Cu/PP, AlN/PI and a self-developed thermal conductive adhesive, were analyzed. The model-based simulation values showed good agreement with the experimental results. Moreover, a discussion on the effects of the newly-introduced parameter was given. Finally, the relationship between the filler radius variation and the thermal conductivity of the composite was studied.
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