Shallow and deep dry etching of silicon using ICP cryogenic reactive ion etching process

Published 2010 View Full Article

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Title
Shallow and deep dry etching of silicon using ICP cryogenic reactive ion etching process
Authors
Keywords
-
Journal
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
Volume 16, Issue 5, Pages 863-870
Publisher
Springer Nature
Online
2010-02-04
DOI
10.1007/s00542-010-1035-7

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