The thermal evaluation of the substrate mixed with microencapsulated phase change materials for MEMS packaging applications

Published 2010 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
The thermal evaluation of the substrate mixed with microencapsulated phase change materials for MEMS packaging applications
Authors
Keywords
-
Journal
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
Volume 17, Issue 4, Pages 693-699
Publisher
Springer Nature
Online
2010-11-04
DOI
10.1007/s00542-010-1154-1

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.