MEMS packaging process by film transfer using an anti-adhesive layer

Published 2010 View Full Article

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Title
MEMS packaging process by film transfer using an anti-adhesive layer
Authors
Keywords
-
Journal
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
Volume 16, Issue 7, Pages 1277-1284
Publisher
Springer Nature
Online
2010-01-20
DOI
10.1007/s00542-010-1021-0

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