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Characterization of the interface between the Hf-based high-k thin film and the Si using spatially resolved electron energy-loss spectroscopy

Journal

MICRON
Volume 41, Issue 1, Pages 15-19

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.micron.2009.07.009

Keywords

High-k dielectric; Interface; Electron energy-loss spectroscopy; HfO2; HfAlO

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Funding

  1. HKSAR [CUHK 402105]

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The interfacial structures of HfO2 and HfAlO thin films on Si have been investigated using spatially resolved electron energy-loss spectroscopy. We have found that interfaces are not atomically sharp, and variation in the symmetry of the local atomic coordination lasts for a couple of monolayers; for both the as-deposited HfO2 and the HfAlO samples. Annealing of the HfO2 film in the oxygen environment leads to the formation of a thick SiO2/SiO. stack layer in-between the original HfO2 and the Si substrate. As a comparison, the interfacial stability is significantly improved by Al incorporation into the HfO2 film (forming HfAlO), which effectively reduced/eliminated the interfacial silicon oxide formation during the oxygen annealing process. The mechanism of the high-k film/substrate stabilization by Al incorporation is discussed based on the experimental results. Crown Copyright (C) 2009 Published by Elsevier Ltd. All rights reserved.

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