Advanced wafer thinning technology and feasibility test for 3D integration

Published 2013 View Full Article

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Title
Advanced wafer thinning technology and feasibility test for 3D integration
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 107, Issue -, Pages 65-71
Publisher
Elsevier BV
Online
2013-02-09
DOI
10.1016/j.mee.2012.10.025

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