Journal
MICROELECTRONIC ENGINEERING
Volume 111, Issue -, Pages 33-38Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.mee.2013.04.039
Keywords
Drug delivery; Microneedles; Dicing saw; Chemical etching
Categories
Funding
- National Natural Science Foundation of China [51035005]
- Important National Science & Technology Specific Projects [2009ZX09310]
- National Key Scientific Program [2010CB933901]
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Drug delivery plays an important role in the treatment of disease, and the equipment used for drug delivery has a great impact on the delivery efficiency of drugs. Recently developed for drug delivery, the new microneedle apparatus has the potential to improve this efficiency. In this study, an incorporated micro-fabrication process is proposed for the formation of tapered silicon microneedles. First, a dicing saw with one beveled blade and one right blade is used to directly cut silicon wafers into the basic shape of tapered microneedles. Next, a chemical etching process containing a dynamic step and static step is deployed to refine the basic shape and form sharp and tapered microneedles 400 mu m in length and 600 pm in width between the tips of two microneedles. A variety of microneedle array patches are fabricated to investigate their ability to pierce artificial skin with forces ranging from 0.1 N to 10 N. The percutaneous experimental results show that the permeation rate of a 7 x 7 microneedle array patch through a treated rat skin is 36 times higher than that for intact skins. Crown Copyright (C) 2013 Published by Elsevier B.V. All rights reserved.
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