Effect of thermal treatment on adhesion strength of Cu/Ni–Cr/polyimide flexible copper clad laminate fabricated by roll-to-roll process

Published 2010 View Full Article

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Title
Effect of thermal treatment on adhesion strength of Cu/Ni–Cr/polyimide flexible copper clad laminate fabricated by roll-to-roll process
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 88, Issue 5, Pages 718-723
Publisher
Elsevier BV
Online
2010-06-24
DOI
10.1016/j.mee.2010.06.044

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