Journal
MICROELECTRONIC ENGINEERING
Volume 87, Issue 5-8, Pages 1226-1228Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.mee.2009.11.147
Keywords
Double layer LOR/positive photoresist lift-off; Metallization of high-aspect-ratio structures; SU-8 microfabrication
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We present a new method to define metal electrodes on top of high-aspect-ratio microstructures using standard photolithography equipment and a single chromium mask. A lift-off resist (LOR) layer is implemented in an SU-8 photolithography process to selectively remove metal at the end of the processing. In this way, we have successfully defined metal electrodes on top of 75 mu m high SU-8 microstructures to be used as test structures for the measurement of temperature increase due to inductive heating. (C) 2009 Elsevier B.V. All rights reserved.
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