Ultrasonic bonding for thermoplastic microfluidic devices without energy director

Published 2010 View Full Article

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Title
Ultrasonic bonding for thermoplastic microfluidic devices without energy director
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 87, Issue 11, Pages 2429-2436
Publisher
Elsevier BV
Online
2010-05-11
DOI
10.1016/j.mee.2010.04.020

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