4.4 Article Proceedings Paper

Characterisation of FIB milling yield of metals by SEM stereo imaging technique

Journal

MICROELECTRONIC ENGINEERING
Volume 86, Issue 4-6, Pages 1021-1024

Publisher

ELSEVIER
DOI: 10.1016/j.mee.2009.01.056

Keywords

Focused ion beam (FIB) milling; Sputtering yield; Stereo imaging technique

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Focused ion beam systems (FIB) are widely used for nanoscale patterning. In a FIB, the volume of the material (mu m(3)) removed from the surface per dose (nC) is key parameter-sputtering yield. Materials such as copper, aluminum, steel, nickel, nickel alumina and silicon are commonly used in electronic industry and micro system devices, hence it will help plan the FIB processes on these materials if the sputtering yields are identified accurately beforehand. This paper reports the study on finding the FIB sputtering yields on these common materials based on stereo imaging technique. (C) 2009 Elsevier B.V. All rights reserved.

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