Analysis of copper ion filaments and retention of dual-layered devices for resistance random access memory applications

Published 2009 View Full Article

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Title
Analysis of copper ion filaments and retention of dual-layered devices for resistance random access memory applications
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 86, Issue 7-9, Pages 1929-1932
Publisher
Elsevier BV
Online
2009-03-21
DOI
10.1016/j.mee.2009.03.102

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