Bonding wire characterization using automatic deformability measurement

Published 2008 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Bonding wire characterization using automatic deformability measurement
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 85, Issue 8, Pages 1795-1803
Publisher
Elsevier BV
Online
2008-05-22
DOI
10.1016/j.mee.2008.05.008

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.