Journal
MICROELECTRONIC ENGINEERING
Volume 85, Issue 1, Pages 161-167Publisher
ELSEVIER
DOI: 10.1016/j.mee.2007.05.005
Keywords
metallic micro-mold; hot-embossing; lithography; parylene-C (poly-chloro-p-xylylene C)
Ask authors/readers for more resources
This study demonstrated a replication process for metallic micro-mold that combines the parylene-C (poly-chloro-p-xylylene C) hot-embossing and electroplating techniques. A nickel original master was fabricated using the deep RIE silicon etching followed by the electroplating process. Then, the patterned fields composed of arrays of 25 mu m-high, 10 mu m-wide and I mm-long lines with 10 mu m spacing in nickel molds were successfully replicated on the 60 mu m-thick parylene-C films by the hot-emboss process. Under complete filling conditions, the deviation of the replicated micropattern was less than 2.4%. The electroplated copper successfully filled parylene-C replica master patterns with the aspect ratio of 2.5 without the void formation by both adding organic addictives and controlling the seed layer thickness. After electroplating, the copper micro-mold could be successfully separated from the parylene-C replica master. (C) 2007 Elsevier B.V. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available