4.4 Article Proceedings Paper

Resistivity measurements of gold wires fabricated by stencil lithography on flexible polymer substrates

Journal

MICROELECTRONIC ENGINEERING
Volume 85, Issue 5-6, Pages 1108-1111

Publisher

ELSEVIER SCIENCE BV
DOI: 10.1016/j.mee.2007.12.069

Keywords

stencil lithography; flexible substrate; polymer; resistivity; flexible electronics; shadow mask

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We report on the patterning and characterization of titanium-gold (Ti-Au) wire test structures on polyethylene naphthalate (PEN), polyethylene terephthalate (PET) and polyimide (PI) substrates. PEN, PET and PI are flexible polymers which can withstand stress and strain. The used patterning method is stencil lithography, a resistless patterning method and based on the shadow mask technique. From the electrical characterization, the resistivity of the Ti-Au wires on the different flexible substrates was determined. (C) 2008 Elsevier B.V. All rights reserved.

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