Numerical study on layout of micro-channel heat sink for thermal management of electronic devices

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Title
Numerical study on layout of micro-channel heat sink for thermal management of electronic devices
Authors
Keywords
Micro-channel heat sink, Thermal performance, Field coordination, Electronics cooling
Journal
APPLIED THERMAL ENGINEERING
Volume 88, Issue -, Pages 480-490
Publisher
Elsevier BV
Online
2014-10-30
DOI
10.1016/j.applthermaleng.2014.09.048

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