Nano-organic silver composite conductive ink for flexible printed circuit

A nano-organic silver composite conductive ink has been developed orienting to the flexible electronics. The conductive ink printed on the flexible substrates turned into highly conductive silver metal after sintered at 250 degrees C. Viscosity and surface tension of the conductive ink were 2.3 cps and 26-29 dyne cm(-1) respectively. The ink remained stable without condensation or agglomeration during preservation. The resistivity of the conductive film, after annealing, was 11.7 mu Omega cm, while the adhesion reached 5B. Transmission electron microscopy (TEM) and scanning electron microscope (SEM) were conducted to observe the morphology of the conductive ink before and after heat treatment, and to help deducing a probable mechanism of the reaction during the synthesis and sintering process. The preparation and characterisation of the composite conductive ink were comprehensively demonstrated in this paper.