Material removal mechanism of copper chemical mechanical polishing in a periodate-based slurry

Published 2015 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Material removal mechanism of copper chemical mechanical polishing in a periodate-based slurry
Authors
Keywords
Chemical mechanical polishing, Copper, Periodate, Surface chemistry, Material removal mechanism
Journal
APPLIED SURFACE SCIENCE
Volume 337, Issue -, Pages 130-137
Publisher
Elsevier BV
Online
2015-02-19
DOI
10.1016/j.apsusc.2015.02.076

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.