Effect of additives on the co-electrodeposition of Sn–Ag–Cu lead-free solder composition

Published 2010 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Effect of additives on the co-electrodeposition of Sn–Ag–Cu lead-free solder composition
Authors
Keywords
-
Journal
Materials Science and Engineering B-Advanced Functional Solid-State Materials
Volume 168, Issue 1-3, Pages 219-223
Publisher
Elsevier BV
Online
2010-02-05
DOI
10.1016/j.mseb.2010.01.017

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.