High-throughput characterization of mechanical properties of Ti–Ni–Cu shape memory thin films at elevated temperature

Published 2011 View Full Article

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Title
High-throughput characterization of mechanical properties of Ti–Ni–Cu shape memory thin films at elevated temperature
Authors
Keywords
-
Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 528, Issue 21, Pages 6552-6557
Publisher
Elsevier BV
Online
2011-05-21
DOI
10.1016/j.msea.2011.05.006

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