Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder

Published 2010 View Full Article

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Title
Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder
Authors
Keywords
-
Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 527, Issue 15, Pages 3335-3342
Publisher
Elsevier BV
Online
2010-02-25
DOI
10.1016/j.msea.2010.02.048

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