Journal
LAB ON A CHIP
Volume 12, Issue 17, Pages 3032-3035Publisher
ROYAL SOC CHEMISTRY
DOI: 10.1039/c2lc21098c
Keywords
-
Categories
Funding
- European Commission
- XMEMS
Ask authors/readers for more resources
We introduce a novel dry wafer bonding concept designed for permanent attachment of micromolded polymer structures to surface functionalized silicon substrates. The method, designed for simultaneous fabrication of many lab-on-chip devices, utilizes a chemically reactive polymer microfluidic structure, which rapidly bonds to a functionalized substrate via click chemistry reactions. The microfluidic structure consists of an off-stoichiometry thiol-ene (OSTE) polymer with a very high density of surface bound thiol groups and the substrate is a silicon wafer that has been functionalized with common bio-linker molecules. We demonstrate here void free, and low temperature (<37 degrees C) bonding of a batch of OSTE microfluidic layers to a silane functionalized silicon wafer.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available