Cyclic, cryogenic, highly anisotropic plasma etching of silicon using SF6∕O2

Published 2008 View Full Article

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Title
Cyclic, cryogenic, highly anisotropic plasma etching of silicon using SF6∕O2
Authors
Keywords
-
Journal
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
Volume 26, Issue 5, Pages 1182-1187
Publisher
American Vacuum Society
Online
2008-09-13
DOI
10.1116/1.2960557

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