Frequency and Temperature Dependence of the Dielectric Properties of a PCB Substrate for Advanced Packaging Applications

Published 2009 View Full Article

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Title
Frequency and Temperature Dependence of the Dielectric Properties of a PCB Substrate for Advanced Packaging Applications
Authors
Keywords
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Journal
JOURNAL OF THE KOREAN PHYSICAL SOCIETY
Volume 54, Issue 3, Pages 1096-1099
Publisher
Korean Physical Society
Online
2009-06-26
DOI
10.3938/jkps.54.1096

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