Electrochemical Impedance Spectroscopy (EIS) Analysis of BTA Removal by TMAH during Post Cu CMP Cleaning Process

Characterization of TMAH based cleaning solution for post Cu-CMP application

(2012) R. Prasanna Venkatesh et al.   MICROELECTRONIC ENGINEERING

Study of Cu-Inhibitor State for Post-Chemical Mechanical Polishing Cleaning

(2011) Ken Harada et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Post-etch residue removal using choline chloride–malonic acid deep eutectic solvent (DES)

(2011) Jenny Taubert et al.   MICROELECTRONIC ENGINEERING

Electrochemical characterization of copper chemical mechanical polishing in l-glutamic acid–hydrogen peroxide-based slurries

(2010) Noyel Victoria Selvam et al.   JOURNAL OF SOLID STATE ELECTROCHEMISTRY

A review of the effects of benzotriazole on the corrosion of copper and copper alloys in clean and polluted environments

(2009) Nageh K. Allam et al.   JOURNAL OF APPLIED ELECTROCHEMISTRY

Impedance and XPS study of benzotriazole films formed on copper, copper–zinc alloys and zinc in chloride solution

(2008) Tadeja Kosec et al.   CORROSION SCIENCE

Evaluation of post-Cu CMP cleaning of organic residues using microfluidic device

(2008) Jeng-Yu Lin et al.   ELECTROCHEMISTRY COMMUNICATIONS

Inhibition effect of some amino acids on copper corrosion in HCl solution

(2008) Da-Quan Zhang et al.   MATERIALS CHEMISTRY AND PHYSICS