Development of a Copper Chemical Mechanical Polishing Slurry at Neutral pH Based on Ceria Slurry

Published 2010 View Full Article

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Title
Development of a Copper Chemical Mechanical Polishing Slurry at Neutral pH Based on Ceria Slurry
Authors
Keywords
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Journal
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume 157, Issue 10, Pages H952
Publisher
The Electrochemical Society
Online
2010-08-30
DOI
10.1149/1.3473801
References
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