ESD and ALD Depositions of Ta[sub 2]O[sub 5] Thin Films Investigated as Barriers to Copper Diffusion for Advanced Metallization

Published 2009 View Full Article

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Title
ESD and ALD Depositions of Ta[sub 2]O[sub 5] Thin Films Investigated as Barriers to Copper Diffusion for Advanced Metallization
Authors
Keywords
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Journal
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume 156, Issue 5, Pages H311
Publisher
The Electrochemical Society
Online
2009-04-01
DOI
10.1149/1.3086781
References
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