Reactively Sputtered Mo–V Nitride Thin Films as Ternary Diffusion Barriers for Copper Metallization

Published 2008 View Full Article

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Title
Reactively Sputtered Mo–V Nitride Thin Films as Ternary Diffusion Barriers for Copper Metallization
Authors
Keywords
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Journal
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume 155, Issue 10, Pages H703
Publisher
The Electrochemical Society
Online
2008-09-06
DOI
10.1149/1.2955726
References
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