Effect of pulse current on the electrodeposition of copper from choline chloride-ethylene glycol
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Title
Effect of pulse current on the electrodeposition of copper from choline chloride-ethylene glycol
Authors
Keywords
Deep eutectic solvent, Copper, Electrodeposition, Pulse plating, Current efficiency
Journal
JOURNAL OF SOLID STATE ELECTROCHEMISTRY
Volume 18, Issue 6, Pages 1657-1663
Publisher
Springer Nature
Online
2014-02-06
DOI
10.1007/s10008-014-2400-8
References
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