Journal
JOURNAL OF PHYSICS D-APPLIED PHYSICS
Volume 42, Issue 3, Pages -Publisher
IOP PUBLISHING LTD
DOI: 10.1088/0022-3727/42/3/035501
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This paper presents a woodpecker-inspired shock isolation (SI) using a microgranular bed to protect micromachined electronic devices (MEDs) for high-g military applications where mechanical excitations reach up to tens of thousands of gs and several hundreds of kHz. The shock isolating phenomenon in the microgranular bed within a metal housing, biomimetically inspired from a spongy bone within a skull of the woodpecker, controls unwanted high-frequency mechanical excitations so that their adverse effects on the embedded MEDs are kept within acceptable limit. The microgranular bed composed of close-packed microglass beads reduces the mechanical excitations transmitted to the MEDs through kinetic energy absorption. Two kinds of tests, a laboratory test and a 60 mm air-gun test, have been made. The laboratory test using a vibration exciter up to 25 kHz has demonstrated that the cut-off frequency (2.2-15.8 kHz) and roll-off steepness (-155.0 to -78.7 dB decade(-1)) are inversely proportional to the diameter of the close-packed microglass beads (68-875 mu m), whereas the vibration absorptivity (0.23-0.87) is proportional. The 60 mm air-gun test under high-g environments of up to 60 000 g has verified that the woodpecker-inspired SI is superior in improving the shock survivability of the MEDs to the conventional one using hard resin.
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