Journal
JOURNAL OF PHYSICAL CHEMISTRY LETTERS
Volume 1, Issue 1, Pages 336-340Publisher
AMER CHEMICAL SOC
DOI: 10.1021/jz9001357
Keywords
-
Categories
Funding
- NSF [DMR 0519081]
- New York State Foundation for Science, Technology and Innovation
Ask authors/readers for more resources
We demonstrate a novel strategy for toughening metal dielectric interfaces by catalyzed fissure of low-polarizability moieties in an organosilane monolayer. Photoelectron spectroscopy and ab initio calculations show that sevenfold toughening of Cu-silica interfaces is due to Cu-catalyzed disilacyclobutane ring opening and bonding. Our findings open up possibilities for directly integrating metals with molecularly derived low permittivity dielectrics for applications without using an intermediary glue layer, for example, by incorporating strained. moieties into polymer precursors.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available