Interplay between Hydrogen Bonding and Molecule–Substrate Interactions in the Case of Terephthalic Acid Molecules on Cu(001) Surfaces

Published 2012 View Full Article

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Title
Interplay between Hydrogen Bonding and Molecule–Substrate Interactions in the Case of Terephthalic Acid Molecules on Cu(001) Surfaces
Authors
Keywords
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Journal
Journal of Physical Chemistry C
Volume 117, Issue 3, Pages 1287-1296
Publisher
American Chemical Society (ACS)
Online
2012-12-28
DOI
10.1021/jp305455v

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