Dual Bonding between H2O/H2S and AgCl/CuCl: Cu/Ag Bond, Sister Bond to Au Bond

Title
Dual Bonding between H2O/H2S and AgCl/CuCl: Cu/Ag Bond, Sister Bond to Au Bond
Authors
Keywords
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Journal
JOURNAL OF PHYSICAL CHEMISTRY A
Volume 117, Issue 42, Pages 10944-10950
Publisher
American Chemical Society (ACS)
Online
2013-09-27
DOI
10.1021/jp407890t

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