Electroless Nickel Alloy Deposition on SiO2 for Application as a Diffusion Barrier and Seed Layer in 3D Copper Interconnect Technology

Published 2014 View Full Article

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Title
Electroless Nickel Alloy Deposition on SiO2 for Application as a Diffusion Barrier and Seed Layer in 3D Copper Interconnect Technology
Authors
Keywords
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Journal
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
Volume 14, Issue 12, Pages 9515-9524
Publisher
American Scientific Publishers
Online
2014-09-25
DOI
10.1166/jnn.2014.10173

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