Article
Mechanics
Xinying Li, Yufei Gao, Runtao Liu, Wei Zhou
Summary: This paper investigates the subsurface damage depth in diamond wire sawing of multi-crystalline silicon solar cell substrates and establishes a mathematical model. The accuracy of the model is verified through experiments, and the impact of different parameters on subsurface damage depth and microcrack number is predicted.
ENGINEERING FRACTURE MECHANICS
(2022)
Article
Materials Science, Multidisciplinary
Shrestha Bhattacharya, Ashutosh Pandey, Jagannath Panigrahi, Sourav Mandal, Vamsi Krishna Komarala
Summary: The performance of silicon heterojunction solar cells is largely dependent on the surface conditioning of silicon. This study investigates the effect of saw damage removal (SDR) treatment on the textured silicon surface morphology and the subsequent performance of SHJ devices. The alkali concentration of the SDR solution is found to directly impact the resulting surface morphology, silicon surface passivation, and SHJ device performance. Optimal device performance is achieved through controlling the silicon surface using an appropriate concentration of the SDR solution. The use of a 30 wt.% NaOH solution forms uniform square pits, leading to nearly homogeneous pyramidal distribution after texturing.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
(2023)
Article
Engineering, Electrical & Electronic
Maria Muzamil Memon, Shuliang Pan, Jiang Wan, Tao Wang, Bin Peng, Wanli Zhang
Summary: This study presents a method for improving the pressure sensitivity of surface acoustic wave (SAW) sensors and verifies its effectiveness through experiments. The results show that the choice of crystal direction is crucial for enhancing the sensitivity of the sensor.
IEEE SENSORS JOURNAL
(2022)
Article
Chemistry, Multidisciplinary
Jian Lin, Hongsub Jee, Jangwon Yoo, Junsin Yi, Chaehwan Jeong, Jaehyeong Lee
Summary: The effects of H2S passivation on the effective minority carrier lifetime of crystalline silicon wafers were studied. The highest gain in minority carrier lifetime, up to 2030%, was observed at an annealing temperature of 600 degrees C. X-ray photoelectron spectroscopy analysis indicated that sulfur passivation eliminated dangling bonds on the silicon wafer surface, resulting in the increase in minority carrier lifetime.
APPLIED SCIENCES-BASEL
(2021)
Article
Chemistry, Analytical
Tengyun Liu, Yancai Su, Peiqi Ge
Summary: This study investigates the breakage ratio of silicon wafers, revealing that transverse vibration is the main cause of wafer breakage. The amplitude, maximum stress, and breakage rate of wafers increase with cutting depth and thinner wafers have a higher breakage ratio.
Article
Engineering, Electrical & Electronic
Zongqiang Li, Peiqi Ge, Wenbo Bi, Chengyun Li, Chao Wang, Jianfeng Meng
Summary: This paper investigates the influence of anisotropy and surface shape deviation on the cutting process of single crystal silicon, and verifies the effect of feed angle of the diamond wire saw on surface shape deviation through experiments. It proposes methods to reduce the impact of silicon anisotropy and surface shape deviation.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
(2021)
Article
Mechanics
Yan Wang, Shengju Huang, Zhaofeng Qian, Jinhuan Su, Lin Du
Summary: In this paper, a minimum thickness analytical model of diamond wire saw cutting monocrystalline silicon wafer is proposed to study the processing mechanism. The model is based on Kirchhoff's thin plate theory and Mohr's strength theory. The analytical model is verified by finite element simulation, with an average error of 9%. Monocrystalline silicon sawing verification experiments are conducted, showing an average error of 7.4% between the experimental results and the calculation results of the analytical model.
ENGINEERING FRACTURE MECHANICS
(2023)
Article
Materials Science, Multidisciplinary
M. Tariq, N. Safdar, S. Scheffler, R. Rolfes
Summary: Photovoltaic modules containing polycrystalline silicon solar cells are widely used for solar energy production. The mechanical analysis of these cells is important due to their various applications. This study investigates the mechanical response of polycrystalline silicon solar cells using a mean-field homogenization scheme. The results show that the homogenized finite element solution accurately represents the progressive failure in solar cells, providing a computationally efficient way to analyze and quantify their degradation.
MATERIALS TODAY COMMUNICATIONS
(2022)
Article
Engineering, Electrical & Electronic
Runtao Liu, Yufei Gao, Chunfeng Yang
Summary: This study proposes a wet sandblasting process to improve the surface quality of diamond wire sawn mc-Si wafers. The results show that wet sandblasting can effectively remove saw marks and amorphous silicon layer, and significantly reduce the reflectivity of the wafers after acid texturing. This has significant implications for the production of solar photovoltaic cells.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2022)
Article
Chemistry, Multidisciplinary
Juan M. Trujillo-Sevilla, Jan Gaudestad, Jose M. Rodriguez-Ramos
Summary: In this study, an improved method for accurately measuring the geometry of silicon wafers is presented. This method is capable of removing the effects caused by gravity and contact with supports. Compared to the classical method, which only requires two measurements, the proposed method requires multiple images but is more immune to misplacement and misalignment of the wafer. Mathematical basis and simulation results demonstrate that the proposed method outperforms the classical method, even for placement errors as small as 100 nm.
APPLIED SCIENCES-BASEL
(2022)
Article
Chemistry, Multidisciplinary
Yujin Jung, Kwan Hong Min, Regina Post, Wolfram Kwapil, Martin C. Schubert, Donghwan Kim, Yoonmook Kang, Hae-Seok Lee
Summary: Improving electrical and optical properties is vital in the manufacturing of high-efficiency solar cells. This study introduces a novel method called saw damage gettering with texturing that combines the benefits of individual gettering and texturing techniques for multicrystalline silicon wafers. The results demonstrate that this method effectively improves the performance of solar cells and could be applicable for future use.
Article
Chemistry, Physical
Jinbing Zhang, Xiaoying Zhou, Dongli Hu, Shuai Yuan, Erhui Cai
Summary: Phase transformation by heat treatment prior to MACE of solar cells is proposed as a pre-treatment approach for DWS Si wafers. Results show that the phase transformation pre-treatment can modify the microstructure of amorphous Si surface layers of DWS mc-Si wafers. The pre-treatment significantly improves the surface uniformity and morphology of the textured Si wafer during MACE.
SURFACES AND INTERFACES
(2023)
Article
Optics
Zhichao Jia, Wei Wang, Xinhua Li, Lingyun Hao
Summary: The damage process of (001) silicon wafer under millisecond Gaussian laser irradiation was investigated, revealing that dislocation multiplication is the main damage mechanism, with melting starting at slip lines. Fracture can also occur outside the spot center. The complexity of the thermal conductivity dependence on dislocation presents challenges in obtaining precise temperature during the cooling period, which requires further research.
OPTICAL ENGINEERING
(2021)
Article
Engineering, Electrical & Electronic
Pengcheng Gao, Baimei Tan, Fan Yang, Hui Li, Na Bian, Xiaoqin Sun, Mengrui Liu, Ru Wang
Summary: This paper investigates the effect of process parameters of reciprocating diamond wire saw on the surface quality of (010) lattice plane beta-Ga2O3 single crystal. A numerical model is established to reduce the depth of subsurface damage layer and improve the surface quality of the wafer, which is verified by slicing experiments. Increasing wire speed or decreasing feed rate can effectively improve the surface quality of the wafer.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
(2021)
Article
Engineering, Electrical & Electronic
Dameng Cheng, Yufei Gao, Chunfeng Yang
Summary: This paper establishes a finite element model and analyzes the influence of hard inclusions on sawing stress by considering the type, size, location, and coupling effect between adjacent inclusions. The research results indicate that the thermal expansion coefficient and size of the inclusions have a direct impact on stress concentration and sawing stress. The study provides theoretical reference for optimizing the sawing process of multi-crystalline silicon.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
(2022)
