Three-dimensional EBSD study on the relationship between triple junctions and columnar grains in electrodeposited Co–Ni films

Published 2008 View Full Article

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Title
Three-dimensional EBSD study on the relationship between triple junctions and columnar grains in electrodeposited Co–Ni films
Authors
Keywords
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Journal
JOURNAL OF MICROSCOPY
Volume 230, Issue 3, Pages 487-498
Publisher
Wiley
Online
2008-05-26
DOI
10.1111/j.1365-2818.2008.02008.x
References
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