A wafer-level Sn-rich Au–Sn intermediate bonding technique with high strength

Published 2013 View Full Article

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Title
A wafer-level Sn-rich Au–Sn intermediate bonding technique with high strength
Authors
Keywords
-
Journal
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 23, Issue 9, Pages 095008
Publisher
IOP Publishing
Online
2013-08-01
DOI
10.1088/0960-1317/23/9/095008

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