Journal
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 19, Issue 6, Pages -Publisher
IOP PUBLISHING LTD
DOI: 10.1088/0960-1317/19/6/065012
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- Dutch Technology Foundation STW [TEL-6630]
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This paper presents a study on the dielectric behavior of SU-8 photoresist. We present measurements on the leakage current levels through SU-8 layers of varying thickness. The leakage current is dominated by thermionic emission. We have further determined the dielectric strength of SU-8 to be 4.4 MV cm(-1). The remarkably high dielectric strength allows the material to be used for high-voltage applications.
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