Microwave-induced, thermally assisted solvent bonding for low-cost PMMA microfluidic devices

Title
Microwave-induced, thermally assisted solvent bonding for low-cost PMMA microfluidic devices
Authors
Keywords
-
Journal
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 20, Issue 1, Pages 015026
Publisher
IOP Publishing
Online
2009-12-08
DOI
10.1088/0960-1317/20/1/015026

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