Article
Engineering, Electrical & Electronic
Deginet Admassu, Tejumade Durowade, Wei Gao, Silviu Velicu, Sivalingam Sivananthan
Summary: This study explores the adhesive wafer bonding of micro-actuators using SU-8 photoresist and how factors such as bonding temperature, pressure, baking time, and photoresist thickness affect the bonding strength. It was found that decreasing exposure dose and post-exposure baking temperature can enhance the bonding strength between micro-chips by inhibiting hardening and promoting softening of the photoresist layer.
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
(2021)
Article
Chemistry, Multidisciplinary
Clement Achille, Cesar Parra-Cabrera, Ruben Dochy, Henry Ordutowski, Agnese Piovesan, Pieter Piron, Lore Van Looy, Shashwat Kushwaha, Dominiek Reynaerts, Pieter Verboven, Bart Nicolai, Jeroen Lammertyn, Dragana Spasic, Rob Ameloot
Summary: Rapid diagnostic testing at the site of the patient is essential when a fully equipped laboratory is not accessible. 3D-printed microfluidic devices offer a scalable route to low-cost diagnostics and eliminate the need for assembly of discrete components. The seamless transition between digital data and physical objects allows for rapid design iterations and opens up perspectives on distributed manufacturing.
ADVANCED MATERIALS
(2021)
Article
Nanoscience & Nanotechnology
Sumin Hwangbo, Luhing Hu, Anh Tuan Hoang, Jae Yong Choi, Jong-Hyun Ahn
Summary: This paper presents a novel fabrication method for the integration of transition metal dichalcogenides with compound semiconductors, which is compatible with a batch microfabrication process. The authors demonstrate the synthesis of a thin film of molybdenum disulfide on a gallium-nitride-based epitaxial wafer, which is then used to form a thin film transistor array. This transistor array is subsequently integrated with micro-light-emitting-diode devices to create an active matrix micro-LED display. The authors also show a simple approach for obtaining red and green colors through the printing of quantum dots on a blue micro-LED, enabling the scalable fabrication of full-color micro-LED displays.
NATURE NANOTECHNOLOGY
(2022)
Article
Chemistry, Multidisciplinary
Jiaona Zhang, Wantings Wang, Jiahao Zhu, Jialiang Wang, Changbin Zhao, Tianyu Zhu, Qinqi Ren, Qi Liu, Rui Qiu, Min Zhang, Xinwei Wang, Hong Meng, Kuan-Chang Chang, Shengdong Zhang, Mansun Chan
Summary: This paper proposes a monolithic three-dimensional (M3D) CMOS design that achieves ultra-flexible electronics with high electronic performance and integration. By utilizing vertically stacked carbon nanotube and indium gallium zinc oxide transistors, this design saves area and exhibits high flexibility. It also enables the development of wearable light recorders for collecting harmful blue light.
ADVANCED FUNCTIONAL MATERIALS
(2023)
Article
Materials Science, Multidisciplinary
Xingliang Li, He Wang, Wudi Zhang, Renjie Li, Ningyu Ren, Sanlong Wang, Yuxiang Li, Qiaojiao Zou, Wei Han, Qixing Zhang, Guofu Hou, Qian Huang, Shengzhi Xu, Chaohua Zhang, Qiang Sun, Ying Zhao, Xiaodan Zhang
Summary: The use of a transparent conductive adhesive (TCA) successfully enables bonding in III-V/silicon tandem solar cells, providing a new solution to the challenge of vacuum bonding in industrialized micron-sized pyramid silicon cells. The TCA exhibits low contact resistance, high transmittance, and good stability, showing great potential in enhancing the performance of solar cells.
ADVANCED MATERIALS TECHNOLOGIES
(2023)
Article
Chemistry, Physical
Layne O. L. Gontijo, Mario N. Barbosa Junior, Druval Santos de Sa, Sonia Letichevsky, Marlin J. Pedrozo-Penafiel, Ricardo Q. Aucelio, Ivani S. Bott, Haimon Diniz Lopes Alves, Benjamin Fragneaud, Indhira Oliveira Maciel, Andre Linhares Rossi, Letizia Savio, Giovanni Carraro, Dosen Anja, Fernando Lazaro Freire Jr, Ghavami Khosrow, Sidnei Paciornik, Omar Ginoble Pandoli
Summary: This study reports the fabrication of bamboo-based graphitic devices with thermoelectric and electrochemical properties through a low heat thermal treatment. The results demonstrate that bamboo exhibits excellent conductivity at specific temperatures, making it suitable for applications as a working electrode and microfluidic heater.
Article
Nanoscience & Nanotechnology
Liang Zhao, Bchara Sidnawi, Jichao Fan, Ruiyang Chen, Thomas Scully, Scott Dietrich, Weilu Gao, Qianhong Wu, Bo Li
Summary: Self-limiting assembly is an advanced technology in nanomanufacturing processes, which allows assembly to stop at a designated stage for applications requiring precise thickness control. The majority of successful self-limiting assembly cases have been achieved on rigid substrates through surface-interaction mechanisms. However, achieving uniform particle assembly on flexible polymer substrates is challenging due to the complex configurations and conformations of polymer chains. In this study, collision-based self-limiting assembly (CSA) is demonstrated to achieve wafer-scale, full-coverage, close-packed monolayers of hydrophobic particles on hydrophobic polymer substrates in aqueous solutions. The kinetic assembly and self-limiting processes are facilitated and controlled by combined acoustic and shear fields.
ACS APPLIED MATERIALS & INTERFACES
(2022)
Article
Chemistry, Analytical
Chuang Wu, Jiju Sun, Binfeng Yin
Summary: This study proposes an integrated molding method for microfluidic chips that combines 3D printing and polymer dissolution technology. The channel mold of Poly(vinyl alcohol) (PVA) or high impact polystyrene (HIPS) is dissolved to complete the manufacturing of microfluidic chip channels. By comparing the microchannels made of PVA and HIPS, it is concluded that the quality of microchannels made of HIPS is significantly better than that made of PVA. This study provides a new idea for the fabrication of microfluidic chips and the application of HIPS.
Article
Chemistry, Multidisciplinary
Ran Guo, Xuan Li, Weilong Niu, Jianbo Feng
Summary: This research proposes a method for fabricating SU-8 polymer micro/nanoscale nozzle using oxygen plasma-assisted room temperature bonding, which can prevent channel deformation and blockage caused by excessive bonding temperature. By optimizing the surface modification parameters of silicon nano-mold, investigating the influence of hot embossing parameters on replication precision of nano patterns, analyzing the effect of UV lithography parameters on micro and nano channels, revealing the relationship between oxygen plasma treatment parameters and SU-8 contact angle, discussing the influence of bonding pressure on nanochannel morphology, and analyzing the bonding principle at room temperature. This method enables the fabrication of SU-8 polymer micro/nanoscale nozzle with low cost and high precision, providing a new idea for room temperature bonding for manufacturing SU-8 polymer nozzle.
NANOTECHNOLOGY REVIEWS
(2023)
Article
Automation & Control Systems
A. P. Ajay, Amitava DasGupta, Dhiman Chatterjee
Summary: Transdermal drug delivery using hollow microneedles is made possible by the use of a single-step spin coating process to achieve the desired thickness of a biocompatible photopolymer, SU-8, while using UV lithography to create a monolithic microneedle array. The fabricated microneedles exhibit robust mechanical properties and low resistance to fluid flow, making them suitable for drug delivery applications.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
(2021)
Article
Chemistry, Multidisciplinary
Kento Yamagishi, Terry Ching, Nicole Chian, Martin Tan, Wenshen Zhou, Shao Ying Huang, Michinao Hashimoto
Summary: This study presents a method for fabricating microfluidic electronics with 3D interconnected networks using DIW-based 3D printing. The integration of electronic elements and injection of liquid metal enables the creation of flexible and stretchable liquid metal antenna coils in support-free microchannels.
ADVANCED FUNCTIONAL MATERIALS
(2023)
Article
Chemistry, Analytical
Zhong Fang, Peng You, Yijie Jia, Xuchao Pan, Yunlei Shi, Junjie Jiao, Yong He
Summary: Three-dimensional integration technology using PDAP as an intermediate bonding polymer was effectively applied in this study for wafer-level integration. The influences of procedure parameters on the adhesive bonding effects were determined through Si-Glass adhesive bonding tests, leading to the identification and optimization of optimal process conditions for 3D integration. This technology was found to be suitable for system-on-chip fabrication, especially for low-cost suspended-microstructure on-CMOS-chip systems.
Article
Physics, Applied
Xinrui Mao, Yanping Li, Wanjin Xu, Zihao Chu, Guangzhao Ran
Summary: In this research, a 3D SU-8 tapered edge coupler is designed and simulated to effectively guide light from an edge-emitting semiconductor laser diode to a silicon waveguide, creating a hybrid on-chip silicon light source. The results show that this polymer taper significantly improves coupling efficiency for moderately thick silicon waveguides, achieving a coupling efficiency of 67% compared to 41% without the taper. The 3D finite-difference time-domain simulations also reveal wave transformation in the tapered coupler and input silicon waveguide. This cost-effective and easily fabricated coupler has potential applications in mass production of various silicon photonic chips.
JOURNAL OF PHYSICS D-APPLIED PHYSICS
(2023)
Review
Computer Science, Information Systems
Jaeyong Jeong, Dae-Myeong Geum, SangHyeon Kim
Summary: Heterogeneous and monolithic 3D (M3D) integration using advanced Si CMOS technology has gained significant interest for next-generation system-on-chips (SoCs) in diverse applications. This paper presents recent progress in the fabrication of III-V devices on Si bottom devices/circuits, focusing on RF and imaging devices. Successful integration of high-performance InGaAs HEMTs on the bottom ICs without substrate noise and the reduction of thermal interaction through the use of an intermediate metal plate have been achieved. The monolithic integration of InGaAs photodetectors on Si bottom devices without thermal damage has also been demonstrated.
Article
Chemistry, Multidisciplinary
Seung-Hyun Mun, Chang-Mo Kang, Jung-Hong Min, Soo-Young Choi, Woo-Lim Jeong, Gi-Gwan Kim, Je-Sung Lee, Kyung-Pil Kim, Heung Cho Ko, Dong-Seon Lee
Summary: Monolithic integration of red, green, and blue inorganic LED thin films on a single substrate using multiple adhesive bonding technique demonstrates structurally stable stacked thin films without the need for mass transfer process. The integrated subpixels can be independently operated with high efficiency and cover a wide range of the color space.
ADVANCED MATERIALS INTERFACES
(2021)
