On-Chip Integration of Acceleration, Pressure, and Temperature Composite Sensor With a Single-Sided Micromachining Technique

Published 2011 View Full Article

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Title
On-Chip Integration of Acceleration, Pressure, and Temperature Composite Sensor With a Single-Sided Micromachining Technique
Authors
Keywords
-
Journal
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 20, Issue 1, Pages 42-52
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2011-01-14
DOI
10.1109/jmems.2010.2100031

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