Flexible Chip-Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain

Published 2009 View Full Article

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Title
Flexible Chip-Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain
Authors
Keywords
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Journal
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 18, Issue 2, Pages 396-404
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2009-02-14
DOI
10.1109/jmems.2009.2013391
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