Wafer-Scale Manufacturing of Bulk Shape-Memory-Alloy Microactuators Based on Adhesive Bonding of Titanium–Nickel Sheets to Structured Silicon Wafers

Published 2009 View Full Article

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Title
Wafer-Scale Manufacturing of Bulk Shape-Memory-Alloy Microactuators Based on Adhesive Bonding of Titanium–Nickel Sheets to Structured Silicon Wafers
Authors
Keywords
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Journal
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 18, Issue 6, Pages 1309-1317
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2009-12-09
DOI
10.1109/jmems.2009.2035368
References
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